AMD Phenom II P860 specifications
General information | |
Type | CPU / Microprocessor |
Market segment | Mobile |
Family |
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Model number ? | P860 |
CPU part number |
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Stepping code | AADIC AD |
Frequency ? | 2000 MHz |
Bus speed ? | One 1800 MHz 16-bit HyperTransport link (3.6 GT/s) |
Clock multiplier ? | 10 |
Package | 638-pin lidless organic micro Pin Grid Array (UOL638) |
AMD Package number | 30605 |
Socket | Socket S1 (S1g4) |
Size | 1.38" x 1.38" / 3.5cm x 3.5cm |
Weight | 0.2oz / 6.5g (by specifications) |
Introduction date | Jan 4, 2011 |
End-of-Life date | Last order date is 3rd quarter 2011 Last shipment date is 1st quarter 2012 |
Architecture / Microarchitecture | |
Microarchitecture | K10 |
Platform | Danube |
Processor core ? | Champlain |
Core stepping ? | BL-C3 |
CPUID | 100F53 |
Manufacturing process | 0.045 micron silicon-on-insulator (SOI) technology |
Data width | 64 bit |
The number of CPU cores | 3 |
The number of threads | 3 |
Floating Point Unit | Integrated, 128-bit wide |
Level 1 cache size ? | 3 x 64 KB 2-way set associative instruction caches 3 x 64 KB 2-way set associative data caches |
Level 2 cache size ? | 3 x 512 KB 16-way set associative caches |
Level 3 cache size | None |
Multiprocessing | Uniprocessor |
Features | |
Low power features | PowerNow! |
Integrated peripherals / components | |
Integrated graphics | None |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1066, DDR3L-1066 Maximum memory bandwidth (GB/s): 17.1 |
Other peripherals | HyperTransport technology 3.0 |
Electrical / Thermal parameters | |
Thermal Design Power ? | 25 Watt |