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AMD Phenom II P860 specifications
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family |
|
| Model number ? | P860 |
| CPU part number |
|
| Stepping code | AADIC AD |
| Frequency ? | 2000 MHz |
| Bus speed ? | One 1800 MHz 16-bit HyperTransport link (3.6 GT/s) |
| Clock multiplier ? | 10 |
| Package | 638-pin lidless organic micro Pin Grid Array (UOL638) |
| AMD Package number | 30605 |
| Socket | Socket S1 (S1g4) |
| Size | 1.38" x 1.38" / 3.5cm x 3.5cm |
| Weight | 0.2oz / 6.5g (by specifications) |
| Introduction date | Jan 4, 2011 |
| End-of-Life date | Last order date is 3rd quarter 2011 Last shipment date is 1st quarter 2012 |
| Architecture / Microarchitecture | |
| Microarchitecture | K10 |
| Platform | Danube |
| Processor core ? | Champlain |
| Core stepping ? | BL-C3 |
| CPUID | 100F53 |
| Manufacturing process | 0.045 micron silicon-on-insulator (SOI) technology |
| Data width | 64 bit |
| The number of CPU cores | 3 |
| The number of threads | 3 |
| Floating Point Unit | Integrated, 128-bit wide |
| Level 1 cache size ? | 3 x 64 KB 2-way set associative instruction caches 3 x 64 KB 2-way set associative data caches |
| Level 2 cache size ? | 3 x 512 KB 16-way set associative caches |
| Level 3 cache size | None |
| Multiprocessing | Uniprocessor |
| Features | |
| Low power features | PowerNow! |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1066, DDR3L-1066 Maximum memory bandwidth (GB/s): 17.1 |
| Other peripherals | HyperTransport technology 3.0 |
| Electrical / Thermal parameters | |
| Thermal Design Power ? | 25 Watt |